计算机科学技术名家讲座
（2014-15）
讲座题目:Investigation of EMC/EMI for 2D and 3D Integrated Circuits and their System-in-Packages using Advanced Computational Electromagnetics（2D 和3D集成电路的电磁兼容/电磁干扰研究及采用计算电磁技术的系统级封装）
主讲人：Prof. Junwei Lu
School of Engineering, Griffith University, Australia
讲座时间：2014年7月22日上午9:30
讲座地点：前卫南校区计算机大楼A521报告厅
主办单位：太阳成集团tyc122cc
太阳成集团tyc122cc计算机科学技术研究所
太阳成集团tyc122cc软件学院
符号计算与知识工程教育部重点实验室
讲座摘要:
The microelectronics industry uses two major technologies; chip technology and packaging technology. Progress in chip technology has been guided by Moore’s Law, which states that the densities of 2-dimensional integrated circuits (2D IC) on silicon chips will double every 18–24 months. Today, the microelectronics industry cannot but look for a new direction in which to grow and that direction is 3-dimensional integrated circuits (3D IC). In 3D IC, the chip technology and packaging technology are merged closer and closer together. Thus, it is of interest to investigate whether there is a Moore’s Law for the packaging technology. If so, what is it and what is its prediction for the future? Indeed, while the microelectronics industry has had a paradigm change from 2D IC to 3D IC, the implementation will be slow and cautious.
The integrate circuit (IC) technology movement-which focuses on system integration rather than transistor density--has led to revolutionary megafunction electronics. The 3D IC integration system-in-packages technology encompasses the packages with wire-bond die-stacks and package-on-package 3D stacks. However, electromagnetic compatibility (EMC) issues have not been managed at the system level due to a lack of fundamental research and scientific approach to this issue. The computer modelling techniques can simulate 3D IC potentially much faster and cheaper. More importantly, it allows the scientist and engineer to “look into” the analysis model, and see where electromagnetic fields are largest; this is almost impossible with physical testing.
主讲人简介：
Prof. Junwei Lu (IEEE Senior Member and ICS Board Member) received the degree in electrical engineering from Xian Jiaotong University, China and the M.Eng. degree in electronic and computer engineering from the National Toyama University, Japan, the Ph.D. degree in electrical and computer engineering from the National Kanazawa University, Japan, in 1991.
From 1976 to 1984, he worked with the State Grid in China, where he was involved in the various national research projects for electrical power industry. In 1985, his academic study and research was in the area of computational electromagnetics at the laboratory of electrical communications at Toyama University, Japan. In 1988, he worked on the applied computational electromagnetics and was involved in the development of magnetics devices with the Laboratory of Electrical Energy Conversion, Kanazawa University. He joined the School of Microelectronic Engineering, Griffith University, Brisbane, Australia, in 1992, and moved to Gold Coast campus to establish Electrical and Electronic Engineering as a Foundation Professor since 2011. His fields of interest are computational electromagnetics, EMC computer modeling and simulation, smart mobile terminal antennas and RF/MW devices and circuits, and high-frequency magnetics for power electronics and renewable energy system, microgrid and EV technology. . He has published over 200 journal and conference papers and one coauthored book in the area of EMC, and holds 10 international patents.
